The Limata UV Laser direct imaging system of the UV-P 200 series presents the ideal solution for the uncompromising maskless high-end PCB production. The high resolution imaging system achieves the shortest and most constant exposure times for photo- and solder resists in its class.
At the same time, direct imaging systems of the advanced class offer a unique level of reliability, even without 24 hour service contracts, due to its intelligent backup system. An outage because of the imaging unit isn't possible anymore.
The system images the conductive pattern according to a specially developed, innovative UV laser direct imaging technology, applying state of the art and cost efficient high power UV semiconductor lasers with a service life of over 10,000 h / 3 years.
The most effective production class:
The advanced LDI models achieve a worldwide unique cost-performance ratio with production capacities up to 150 mē double-layer panels per day and an immediate positive ROI assuming a production level requiring 30 maskplots a day.
A LDI system of the advanced class substitutes the entire photolithography system including photo plotter and exposure unit of middle-sized circuit board manufacturers, and enables the production of European medium batch series, with constant and short throughput-times. Normal dry resist (30-100 um) as well as solder resists are structured rapidly.
The unique advantages of the Limata LDI technology
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Integrated redundant backup solution in case of malfunction of a laser unit
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No 24 hours service agreement necessary, complete reliability.
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Get a personal appointment for a demonstration
The Limata LDI systems are practically proven industry machines. Together with our sales team we can offer you to schedule an appointment at the production of a PCB manufacturer, to experience the Limata direct imaging system in action.
Everytime upgrade to higher troughputs
With the advanced class it is possible to change up. Purchasing a UV-P200-2/3 you maintain the possibility to easily and cost-effectively upgrade to the higher-capacity models of the premium class.
Further Key Features of Limata´s LDI Technology
- Payback period less than 1 year.
- Very low maintenance cost, high uptime and lifetime of both optical as well as mechanical components.
- No expensive laser sources, state of the art semiconductor sources
- Auto alignment and focus.
- Works with all types of PCB substrates and substrate thicknesses.
- Very low thermal stress on photoresist.
- Suitable for the curing of solder resist.
- Intuitive scaling of layout data via proprietary software PATH X.
- Fast and safe load lock system with vacuum stage and alignment pins.
| Do you have any questions to the product models or do you want to visit us for a demo? Please do not hesitate and contact us here! |
Technical Data
Panel size: |
700 mm x 600 mm
further sizes possible on request |
Minimal resolution: |
50 um/ 2 mil
25 um optional |
Throughput:
ADVANCED
Versions
(UV-P200-2/-3) |
Panel size: 610 mm x 457 mm
Resist 50 mJ/cm2
Exposure Time: 80 s
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Positioning: |
+/- 1 um (repeat accuracy)
+/- 3 um (absolut)
Linear motor system with laser interferometric calibration
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Positioning: |
+/- 1 um (repeat accuracy)
+/- 3 um (absolut)
Linear motor system with laser interferometric calibration
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Depth of focus: |
Optimized deph of focus
+/- 300 um |
Laminate thickness: |
0,1 mm - 10 mm
up to 120 mm optional |
Media: |
Dry and liquid coated panels
e.g. Ordyl, Dupont, Hitachi Chemicals, Murakami
Solder resists
z.B. Peters, Tayio, SunChemicals
Masks / silver Films
silver films (e.g. Agfa Idealine OPF)
Direct imaging of diazofilms |
Software: |
Limata Software Path X |
Interface: |
Ethernet, Digital I/O 24 V DC |
Data format: |
Extended Gerber RS274-X, HPGL
further formats
on request |
Registration: |
HD camera system |
User interface: |
LCD Touch Screen 8" |
Loading / Unloading : |
Manual loading / unloading via
vaccum drawer system
Optional:
Robot unit for automatic loading /
unloading for 24 / 7 manufacturing
process |
Dimension & weight: |
Height: 1,6 m
Width: 1,2 m
Depth: 1,5 m
Weight: 1.500 kg |
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Laser Scan exposure process:
Innovative UV Laser exposure system
Innovative vacuum drawer system:
Manual or
automatic Robot unit loading / unloading
Touch Screen User Interface:
Intuitive Touch Screen Menu with job mode
Highest exposure resolution:
To 50 microns / 2 mil in line and space
Direct exposure process of Diazo films:
Direct exposure process of Diazo films
without any green light room and mask plot
Sharp edges:
Perfection through newest laser technology
Ideal polymerisation for solder resists:
Perfect wavelength for all colors of solder resists
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