The Limata UV-P200 UV laser direct imaging system is predestinated for high demands in the field of small and middle-sized series production by using two redundant exposure sources. The 25 micron high-resolution system reaches the fastest, constant exposure times for dry resits and solder resists in its machine class. The UV-P200 offers a unique operational safety without 24 hours service contract due to its intelligent backup system. A failure of the exposure process caused by the light sources is no longer possible.
The UV-P200 replaces the complete photo lithography technique of photo plotter and exposure unit for middle-sized circuit board manufacturers and manufactures of both, prototypes and small lots, with constant and fast throughput-times. Both, normal dry resist (30-100 um) and solder resists are structured rapidly.
The unique benefits of the Limata LDI Technology
Everytime fast upgrade for higher throughputs
You need higher throughputs for medium and mass production and you want to replace a few photoplotters and contact exposure units through the LDI technology? The Limata LDI Technology can be configured to achieve daily throughputs for medium and mass production. You will finde more information to the custom made UV-P LDI systems of Limata here.
Further Key Features of Limata´s LDI Technology
- Payback period less than 1 year.
- Very low maintenance cost, high uptime and lifetime of both optical as well as mechanical components.
- No expensive laser sources, newest semiconductor laser
- Auto alignment and focus.
- Works with all types of PCB substrates and substrate thicknesses.
- Very low thermal stress on photoresist.
- Intuitive scaling of layout data via proprietary software PATH X.
- Fast and safe load lock system with vacuum stage and alignment pins.
Do you have any questions to the product models or do you want to visit us for a demo? Please do not hesitate and contact us here! |
Technical Data
Panel size: |
610 mm x 540 mm / 24" x 21"
further sizes possible on request |
Minimal resolution: |
25 um/ 1 mil |
Positioning: |
+/- 2 um (repeat accuracy)
+/- 5 um (absolut) |
Laminate: |
All laminates
(FR4, IMS, Keramik etc.) |
Laminate thickness: |
0,1 mm - 10 mm |
Media: |
Dry and liquid coated panels
films (e.g. Agfa Idealine OPF) |
Software: |
Limata Software Path X |
Interface: |
Ethernet |
Data format: |
Extended Gerber RS274-X, HPGL
further formats
on request |
Registration: |
HD camera system |
User interface: |
LCD Touch Screen 8" |
Loading / Unloading : |
Manual loading / unloading via
vaccum drawer system
Optional:
Robot unit for automatic loading
/ unloading for 24 / 7 manufacturing process |
Dimension & weight: |
Height: 1,3 m / 52"
Width: 1,3 m / 52 "
Depth: 1,1 m / 44 "
Weight: 1.500 kg |
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Laser Scan exposure process:
Innovative UV Laser exposure system
Innovative vacuum drawer system:
Manual or
automatic Robot unit loading / unloading
Touch Screen User Interface:
Intuitive Touch Screen Menu with job mode
Highest exposure resolution:
To 25 microns / 1 mil in line and space
Sharp edges:
Perfection through newest laser technology
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