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UV-P100 Series UV Laser Direct Imaging System of the PROFESSIONAL class

The Limata UV Laser direct imaging system of the 100 series presents the ideal solution for the quick and safe entry in the maskless PCB production with constant exposure times and demanding daily throughput. The high resolution imaging system achieves the shortest and most constant exposure times of its class.


The system images the conductive pattern according to a specially developed, innovative UV laser direct imaging technology, applying state of the art and cost efficient high power UV semiconductor lasers with a service life of over 10,000 h / 3 years.

New: Improved depth of focus

Compared to systems of the DLP technology, the Limata UV laser direct imaging system offers an improved depth of focus of up to 600 um absolute.

This leads to highest process safety and ideal imaging results under height tolerances of the base material and solder resist.

The most effective entry class:
The cost efficient professional models achieve a worldwide unique cost-performance ratio with production capacities up to 75 mē per day and an immediate positive ROI assuming a production level requiring 10 maskplots a day.

The UV-P100 / 150 substitutes the entire photolithography system including photo plotter and exposure unit of middle-sized circuit board manufacturers, and enables the production of prototypes and small batches, with constant and short throughput-times. Normal dry resist (30-100 um) as well as solder resists are structured rapidly.

Feedback from our customers about the UV-P 100

„We were able to integrate the direct imaging system UV-P 100 in all processes of our company. The flexible possibility to quickly produce prototypes in combination with the possibility to plot your own films, make up a custom-fit solution, what lead to our decision to invest. With the UV-P 100, we sustainably increase our company's profitability through an innovative product."

Get a personal appointment for a demonstration

The Limata LDI systems are practically proven industry machines. Together with our sales team we can offer you to schedule an appointment at the production of a PCB manufacturer, to experience the Limata direct imaging system in action.

Schedule a demonstration appointment



Everytime upgrade to higher troughputs

The professional class offers highest flexibility to increase capacity. Purchasing a UV-P100/150 you maintain the possibility to easily and cost-effectively upgrade to the higher-capacity models of the advanced or premium class.

Further Key Features of Limata´s LDI Technology

  • Payback period less than 1 year.
  • Very low maintenance cost, high uptime and lifetime of both optical as well as mechanical components.
  • No expensive laser sources, state of the art semiconductor sources
  • Auto alignment and focus.
  • Works with all types of PCB substrates and substrate thicknesses.
  • Very low thermal stress on photoresist.
  • Suitable for the curing of solder resist.
  • Intuitive scaling of layout data via proprietary software PATH X.
  • Fast and safe load lock system with vacuum stage and alignment pins.


Technical Data

Panel size:

700 mm x 600 mm
further sizes possible on request

Minimal resolution:

50 um/ 2 mil
25 um optional

Throughput:
PROFFESIONAL
Versions
(UV-P100 / 150)

Panel size: 610 mm x 457 mm
Resist 50 mJ/cm2
Exposure Time: 200 s

Positioning:

+/- 1 um (repeat accuracy)
+/- 3 um (absolut)

Linear motor system with laser interferometric calibration

Positioning:

+/- 1 um (repeat accuracy)
+/- 3 um (absolut)

Linear motor system with laser interferometric calibration

Depth of focus:

Optimized deph of focus
+/- 300 um

Laminate thickness:

0,1 mm - 10 mm
up to 120 mm optional

Media:

Dry and liquid coated panels
e.g. Ordyl, Dupont, Hitachi Chemicals, Murakami

Solder resists
z.B. Peters, Tayio, SunChemicals

Masks / silver Films
silver films (e.g. Agfa Idealine OPF)

Direct imaging of diazofilms

Software:

Limata Software Path X

Interface:

Ethernet, Digital I/O 24 V DC

Data format:

Extended Gerber RS274-X, HPGL
further formats on request

Registration:

HD camera system

User interface:

LCD Touch Screen 8"

Loading / Unloading :

Manual loading / unloading via
vaccum drawer system

Optional:

Robot unit for automatic loading /
unloading for 24 / 7 manufacturing
process

Dimension & weight:

Height: 1,6 m
Width: 1,2 m
Depth: 1,5 m
Weight: 1.300 kg

 



UV-P100



Laser Scan exposure process:
Innovative UV Laser exposure system





Innovative vacuum drawer system:
Manual or
automatic Robot unit loading / unloading





Touch Screen User Interface:
Intuitive Touch Screen Menu with job mode





Highest exposure resolution:
To 50 microns / 2 mil in line and space




Direct exposure process of Diazo films:
Direct exposure process of Diazo films
without any green light room and mask plot




Sharp edges:
Perfection through newest laser technology





Ideal polymerisation for solder resists:
Perfect wavelength for all colors of solder resists